Flexible substrates (FPCs) are often used in miniaturized portable electronic products, such as smartphones, cameras, microphones, displays, etc. Due to its small size, low colloid viscosity, high spraying accuracy requirements, adhesive thickness below 100um, and coating requirements without bubbles.
Printed Circuit Board (PCB) is the support body of electronic components, the carrier of electrical connections of electronic components, and has a high-density design. Its surface is often covered with a large number of micro components, requiring precise positioning. Different sizes of components are sprayed with different amounts of adhesive for coating protection.

The camera module has a compact internal structure and precise assembly. The structure of the camera module is very fine, and there are multiple internal components that require dispensing technology. The main adhesives used are UV glue, bottom filling glue, low-temperature curing glue, etc. The dispensing space is narrow, and the requirements for the adhesive points are small and the position is high.
The current issues with camera module dispensing are:
1. Traditional equipment cannot achieve precise positioning;
2. The defect rate of contact dispensing such as needle cylinder is high;
The automatic dispensing solution for Hongzhan camera module can help you solve:
1. Precision dispensing, precise positioning, reducing production costs, and improving production efficiency;
2. Intelligent operating system, easy to operate, easy to learn and use.

The bottom filling is usually carried out on BGA packaged chips using highly permeable colloids (mainly epoxy resin), and the components are bonded and fixed for reinforcement using a heated curing form. The technical difficulty lies in the good flowability of the bottom filling adhesive, easy scattering, and strict requirements for the height and position of the adhesive spraying.
Hongzhan Spray Glue Solution:
Adopting a low viscosity spray valve system, with a maximum operating frequency of 1200Hz, the spray force channel is fine tuned through the HMI upper computer, effectively solving the problem of scattered points and achieving high efficiency, high yield, and rapid production.

With the rise of narrow borders, full screen smartphones and mobile devices. Intelligent wearable devices and other digital products require ultra-high performance during production and assembly due to their lightweight and ultra-thin design, as well as their ability to adapt to various environments in a complex manner. Therefore, structural bonding, screen bonding, component positioning, and assembly are usually required to achieve ultra-fine line width and ultra-high adhesive thickness (width<0.4mm, aspect ratio>60%), requiring ultra-fine dispensing and high stability in dispensing amount. To ensure that the product has high adhesion and reliable waterproof sealing, while providing reliable physical protection, with good impact resistance and effective resistance to impact and vibration during movement, better protecting electronic components.
Hongzhan Precision Automatic Gluing Solution can help you solve:
1. Precision dispensing, precise positioning, reducing production costs, and improving production efficiency;
2. Intelligent operating system, easy to operate, easy to learn and use.
3. One stop service, after-sales support, easy to handle

In recent years, with the improvement of chip packaging integration, the reduction of chip size, and the strengthening of cost control in the SMT process, the printing/screen printing process has become inadequate, and the demand for high-precision silver dots and solder paste applications is increasingly expanding. The biggest problem that needs to be solved for dispensing is speed. Ordinary contact dispensing can only reach 5-7 dot/s, and the consistency of the dispensing points is poor.