1. Improve the reliability of built-in electronic products in cars
The power and control system of a car is mainly composed of many electronic products, which need to be sealed to enhance the moisture-proof and anti-corrosion capabilities of the components. Among these key processes, the Hongzhan plasma surface treatment process can effectively clean and activate the surface of electronic products, improve the adhesion and reliability of subsequent injection molding and gluing processes, reduce layering and other phenomena, and ensure the safe and stable operation of electronic systems.
2. Improving the sealing performance of car headlights
LED car lights have the characteristics of energy conservation, environmental protection, and good seismic resistance, and have become the mainstream development direction. Before metal vapor deposition, shell bonding and other processes, the use of Hongzhan Automation Plasma Surface Treatment Technology can improve the bonding force between various materials, improve the overall sealing of the car lights, enhance the service life of the car lights, and be durable.
3. Sealing strip - improving the adhesion of coated flocking
Make the sealing strip more effective in preventing wind, rain, and noise. To achieve this effect, it is necessary to spray a functional coating on its surface. Plasma pre-treatment technology before spraying can improve product yield, enhance coating adhesion and uniformity.

Almost all processes in semiconductor device production involve cleaning, with the aim of thoroughly removing particles, organic and inorganic impurities from the device surface to ensure product quality. The importance of plasma cleaning technology is indispensable.
The physical and chemical cleaning methods widely used in the semiconductor packaging industry can be roughly divided into two categories: wet cleaning and dry cleaning. Especially, dry cleaning has developed very quickly. Among them, plasma cleaning has obvious advantages, which can help improve the adhesion performance between grains and solder pads, solder paste wetting performance, metal wire bonding strength, reliability of plastic packaging materials and metal shell coating. In semiconductor devices, microelectromechanical systems Widely promoted and applied in packaging fields such as optoelectronic components.
To protect semiconductor integrated circuit chips or electronic devices that are highly susceptible to damage from the surrounding environment, including physical and chemical effects, and to ensure their various normal functions, membrane technology and micro linking technology are used to arrange, fix, and link semiconductor components and gas components on the frame or substrate. The process technology of leading out wiring terminals and fixing them with plastic insulation medium to form a practical overall three-dimensional structure.

After the plasma surface processor processes the coated color box, various physical and chemical changes occur on the surface of the film, such as etching and roughness, forming a dense cross-linked layer, or introducing oxygen-containing polar groups to improve hydrophilicity, adhesion, dyeability, biocompatibility, and electrical properties. Multiple oxygen-containing groups are introduced to transform the surface from non-polar and difficult to stick to having certain polarity, easy to stick, and hydrophilicity, Improve the surface energy of the bonding surface. Equivalent to bonding ordinary paper with ordinary paper, the product quality is more stable, completely eliminating the problem of adhesive opening.
With the continuous improvement of requirements for paper box packaging materials, the market not only demands the appearance of packaging paper boxes, but also puts forward more requirements for functionality and quality. For example, the materials used for processing paper boxes, such as face paper and inner paper, are no longer simple papers, but more new materials such as coated paper, glossy paper, coated paper, or aluminum plated paper are used, or plastic sheets such as PP and PET are directly used. These new materials bring a lot of help to the performance and quality of packaging paper boxes.

At present, plasma devices are widely used in the mobile phone industry for processing, and almost every accessory inside the phone is treated with plasma.
The phone case needs to be printed, the phone glass panel needs to be bonded and coated, including the phone module and the middle frame, which need to be cleaned with plasma. The traditional method is to use chemical agents, but there are many advantages and disadvantages to this traditional method, such as high cost, high pollution, and low efficiency. In contrast, the emergence of plasma cleaning has low implementation cost, high efficiency, and basically no pollution. It can be said that ions have changed the entire mobile phone manufacturing industry.
Plasma equipment mainly processes TP screen materials, utilizing plasma to activate and etch their surfaces, which can remove residual organic and particulate pollutants on the surface of TP screens that are difficult to distinguish with the naked eye, and improve wetting performance. Improve the quality of subsequent bonding, coating, printing and other processes to enhance product quality, increase yield, and extend product lifespan.

Glass substrate:
Using plasma technology to bombard the surface of materials can effectively remove surface pollutants and greatly improve the hydrophilicity of the workpiece surface. The angle between the cleaned water droplets is less than 5 degrees, laying a solid foundation for the next process.
Anode surface modification:
Surface modification of ITO anode using plasma technology can effectively optimize its surface chemical composition, greatly reduce (lower) block resistance, thereby effectively improving energy conversion efficiency and improving the photovoltaic performance of the device.
Preparation before applying protective film:
The surface of silicon wafers is very bright and will reflect a large amount of sunlight. Therefore, it is necessary to deposit a layer of silicon nitride protective film with a very low reflection coefficient on it. By using plasma technology, the surface of silicon wafers can be activated, greatly improving their surface adhesion.
Battery industry
Welding improvement of electrode ears, electrode plates, and electrode columns, improving (enhancing) quality and reducing (lowering) internal resistance;
Pre treatment of shell coating to improve adhesion;
After cutting the positive and negative electrode materials of the battery, clean (remove) surface particles and improve the quality of the battery cell;